Laser methods for circuit repair on integrated circuits and subs

Details Laser methods for circuit repair on integrated circuits and subs Laser methods for circuit repair on integrated circuits and subs

1991-10-04

1992-12-15

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437228, 437245, 437248, 437935, 20415747, H01L 2126, H01L 21465, C01B 3100

Patent

active

051717093

ABSTRACT:
The present invention relates to a method of accessing and repairing electrical opens in conducting metal lines on a semiconductor chip or other substrate using a thin conductive layer formed within the surface of a substrate and laser plating techniques. What has been described is a maskless means of repairing discontinuities in a conductor disposed on the surface of a substrate wherein the surface is locally irradiated to form a reversible carbonaceous layer thereon. This reversible carbonaceous layer acts as a base for electrodeless deposition of a metal to form a bridge across the discontinuity by laser-enhanced exchange plating or other suitable methods. Further, a means of accessing and repairing a discontinuity buried by a cover layer of an insulating or passivating material is described, wherein access to the discontinuity is provided by ablating away the cover layer using a pulsed excimer laser at a first power level.

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