Laser method for forming low-resistance ohmic contacts on semico

Details Laser method for forming low-resistance ohmic contacts on semico Laser method for forming low-resistance ohmic contacts on semico

1979-10-01

1981-04-14

Ozaki, G.

Metal treatment

Compositions

Heat treating

219121L, 357 65, 357 70, 357 91, H01L 21263, H01L 718, B23K 900

Patent

active

042617642

ABSTRACT:
This invention is a new method for the formation of high-quality ohmic contacts on wide-band-gap semiconducting oxides. As exemplified by the formation of an ohmic contact on n-type BaTiO.sub.3 containing a p-n junction, the invention entails depositing a film of a metallic electroding material on the BaTiO.sub.3 surface and irradiating the film with a Q-switched laser pulse effecting complete melting of the film and localized melting of the surface layer of oxide immediately underlying the film. The resulting solidified metallic contact is ohmic, has unusually low contact resistance, and is thermally stable, even at elevated temperatures. The contact does not require cleaning before attachment of any suitable electrical lead.
This method is safe, rapid, reproducible, and relatively inexpensive.

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