Laser marking system

Electric heating – Metal heating – By arc

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C219S121830, C250S201200

Reexamination Certificate

active

07915564

ABSTRACT:
A laser energy microinscribing system, comprising a semiconductor excited Q-switched solid state laser energy source; a cut gemstone mounting system, allowing optical access to a mounted workpiece; an optical system for focusing laser energy from the laser energy source onto a cut gemstone; a displaceable stage for moving said gemstone mounting system with respect to said optical system so that said focused laser energy is presented to desired positions on said gemstone, having a control input; an imaging system for viewing the gemstone from a plurality of vantage points; and a rigid frame supporting said laser, said optical system and said stage in fixed relation, to resist differential movements of said laser, said optical system and said stage and increase immunity to vibrational misalignments. The laser energy source is preferably a semiconductor diode excited Q-switched Nd:YLF laser with a harmonic converter having an output of about 530 nm. The system may further comprise an input for receiving marking instructions; a processor for controlling said displaceable stage based on said marking instructions and said imaging system, to selectively generate a marking based on said instructions and a predetermined program; and a storage system for electronically storing information relating to images of a plurality of workpieces. A secure certificate of authenticity of a marked workpiece is also provided.

REFERENCES:
patent: 2293100 (1942-08-01), Baumgold
patent: 3803379 (1974-04-01), McRay
patent: 3805015 (1974-04-01), Herziger et al.
patent: 3947120 (1976-03-01), Bar-Issac et al.
patent: 4166574 (1979-09-01), Yokoyama
patent: 4392476 (1983-07-01), Gresser et al.
patent: 4493967 (1985-01-01), Wolfe
patent: 4541055 (1985-09-01), Wolfe et al.
patent: 4677639 (1987-06-01), Sasser
patent: 4749847 (1988-06-01), Despres
patent: 4845335 (1989-07-01), Andrews et al.
patent: 4939739 (1990-07-01), Hobart et al.
patent: 4940880 (1990-07-01), Klingel et al.
patent: 4950861 (1990-08-01), Erlenmaier et al.
patent: 5172390 (1992-12-01), Mooradian
patent: 5216235 (1993-06-01), Lin
patent: 5227607 (1993-07-01), Ishiyama
patent: 5381457 (1995-01-01), Burns
patent: 5418088 (1995-05-01), Alexandres
patent: 5483038 (1996-01-01), Ota et al.
patent: 5483055 (1996-01-01), Thompson et al.
patent: 5504303 (1996-04-01), Nagy
patent: 5811754 (1998-09-01), Nakatani et al.
patent: 5825982 (1998-10-01), Wright et al.
patent: 5983238 (1999-11-01), Becker et al.
patent: 6002099 (1999-12-01), Martin et al.
patent: 9520365 (1995-12-01), None
patent: 62-267093 (1987-11-01), None
patent: 5049998 (1993-03-01), None
patent: 06-090052 (1994-03-01), None
patent: 07-136784 (1995-05-01), None
Christensen, C. Paul; “Waveguide excimer laser fabrication of 3D microstructures” SPIE vol. 245 pp. 141-145 (1994).
Konov, V.I. et. al.; “Laser microprocessing of diamond and diamond-like films” SPIE vol. 2045 pp. 184-192 (1994).
Ewing, J.J.; “Advance in Solid State Lasers and Potential Industrial Application” SPIE vol. 2062 pp. 151-158) (1994).
Christensen, C. Paul; “Micromaching of Diamond Substrates with Waveguide Excimer Lasers” SPIE vol. 2062 pp. 14-21 (1994).
Wang, et al.; “Workpiece form accuracy in-process and control system—a discussion on key parts and preliminary experiment” SPIE vol. 2101 Measurement Technology and Intelligent Instruments pp. 1447-1450 (1993).
Holly, et al.; “Novel process for figuring and polishing diamond surfaces” SPIE vol. 2114 pp. 127-135 (1994).
Wieloch, G., Pohl, P.“Use of laser in the furniture industry” SPIE vol. 2202 pp. 604-607 (1995).
Averin, A. et al.; “High power CO lasers for materials processing” , SPIE vol. 2206 pp. 154-162 (1994).
Liao, Xian-Ning, Beckmannn, L.H.J.F.; “CALMP—a PC database and simulation software for laser material processing” SPIE vol. 2207 pp. 301-213 (1994).
Wiedmaier m., et al.; “Efficient production by laser materials processing integrated into metal cutting machines” SPIE vol. 2207 pp. 16-26 (1994).
Kautek, Wolfgang, Kruger, Jorg; “Femotosecond pulse laser ablation of metallic, semiconducting, ceramic and biological materials” SPIE vol. 2207 pp. 600-611 (1994).
Ahlers R-J, et al.; “Lasercaving and Image Processing: two technologies combined”, SPIE vol. 2246 Laser Materials Processing and Machining pp. 115-119 (1994).
Schmidt H., et al.; “Excimer Laser Micromachining Based on Dielectric Masks” SPIE vol. 2246 Laser Materials Processing and Machining pp. 67-73 (1994).
Kumar M., et al.; “Marble Cutting with CW CO2Laser” SPIE vol. 2374 pp. 34-39 (1995).
Cunningham D., Jacobs R.; “Commercial applications of high powered laser diodes”, SPIE 2382 pp. 72-77 (1995).
Loosen, P., et. al.; “High-power diodes-lasers and their direct industrial applications”; SPIE vol. 2382 pp. 78-88 (1995).
Monson, Robert J.; “Techniques for the automated analysis and grinding of desired profiles in materials”, SPIE vol. 2595 pp. 80-91 (1995).
Schaeffer, Ronald D.; “Novel high-power ND:YLF laser CVD-diamond micromachining” SPIE vol. 2639 pp. 325-334 (1995).
Christensen, C. Paul.; “Laser Microfabrication from a Commercial Perspective”; SPIE Fifth International Symposium on Laser Precision Microfabrication. Edited by Miyamoto, Isamu; Helvajian, Henry; Itoh, Kazuyoshi; Kobayashi, Kojiro F.; Ostendorf, Andreas; Sugioka, Koji. Proceedings of the SPIE, vol. 5662, pp. 10-17 (Oct. 2004).
Banas, C.M., Webb, R.; “Macro-Materials Processing”; Proceedings of the IEEE, Jun. 1982, vol. 70, Issue: 6, pp. 556-565, ISSN: 0018-9219.
Christensen, C. Paul; “UV6.3 Ultraviolet Waveguide Lasers And Applications”, Lasers and Electro-Optics Society Annual Meeting, Nov. 2-4, 1988 pp. 233-237.
Christensen, C. Paul; “UV1.2 UV Waveguide Lasers for Instrumentation Applications”; Lasers and Electro-Optics Society Annual Meeting, IEEE Nov. 4-9, 1990 pp. 526-529.
Christensen, C. Paul; “Capabilities of Low Power Excimer Lasers in Micromachining”; Lasers and Electro-Optics Society Annual Meeting, IEEE Nov. 15-18, 1993 pp. 762-763.
Christensen, C. Paul; “Laser Micromachining in Medical Device Manufacturing”; IEEE Lasers and Electro-Optics Society Annual Meeting, Orlando, FL, Dec. 3-4, 1998, vol. 2, p. 445(1998).
Cohen, Martin, G., et al.; “Micro-Materials Processing”, Proceedings of the IEEE, vol. 70 No. 6, pp. 545-555; Jun. 1982.
Ral'Chenko, et al.; “Fine Patterning of Diamond Films by laser-assisted chemical etching in oxygen”; Diamonds and Related Materials 4 (1995) 893-896 (presented Sep. 25-30, 1994).
Gloor, S., et al.; “Submicron laser writing on diamond”, Diamond and Related Materials 8 (1999) 1853-1856.
Rothschild, M., Arnone, C., Ehrlich, D.J.; “Excimer-laser etching of diamond and hard carbon films by direct writing and optical projection”, J. Vac. Sci Technol B 4(1); Jan./Feb. 1986 pp. 310-314.
Singh, R., Dong-Gu, Lee; “Excimer Laser-Assisted Planarization of Thick Diamond Films” Journal of Electronic Materials, vol. 25, No. 1, 1996, pp. 137-142.
Windholz,R., Molian, P.A.; “Nanosecond pulsed excimer laser machining of chemical vapour deposited diamond and higly oriented pyrolytic graphite”, Journal of Materials Science 32(1997)4295-4301.
Toda, M., et al.; “Laser Materials for the 0.67-μm to 2.5-μm Range”, NASA Contractor Report 4050 HDL-CR-86-351-1, Contract NAS1-17351; Mar. 1987.
Fabis, Philip; “Laser machining of CVD Diamond: chemical and structural alteration effects”, Surface and Coatings Technology 82 (1996) 320-325.
Gresser, Herbert D.; “Laser Sawing of Diamonds”, Technical Paper, Society of Manufacturing Engineers 1976, MR76-855.
Ballistic Missile Defense Organization Technology Applications Report, NTTC (1995).
Brannon, James H.; &#

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Laser marking system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser marking system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser marking system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2722929

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.