Radiation imagery chemistry: process – composition – or product th – Microcapsule – process – composition – or product
Patent
1986-01-27
1987-03-31
Kittle, John E.
Radiation imagery chemistry: process, composition, or product th
Microcapsule, process, composition, or product
29574, 295767, 264 22, 264132, 26427217, 42721331, 42721336, 427221, 430945, B05D 306, B01J 1302, H01L 21265, B23K 2600
Patent
active
046542906
ABSTRACT:
An improved laser markable material useful for encapsulation of electronic devices is obtained by adding TiO.sub.2 or TiO.sub.2 +CrO.sub.3 to common plastic encapsulants formed from a mixture of a resin+filler+carbon black+mold release agent. When irradiated by a laser, the originally grey material turns bright gold, providing a high contrast durable mark. The material has excellent marking contrast as well as better stability with time and temperature as compared to prior art laser markable encapsulants. Desirable concentrations, in weight percent of the compound, are 1-5% TiO.sub.2 and 0-3% CrO.sub.3, with 1-3% TiO.sub.2 and 0.5-2% CrO.sub.3 being preferred. Carbon black is optional but a concentration in the range 0.1-3% by weight is desirable with 0.5-1% preferred. Improved encapsulation and marking methods and improved devices using this material are described.
REFERENCES:
patent: 3869563 (1976-07-01), Ocken, Jr.
patent: 3969327 (1976-07-01), Stein et al.
patent: 4042550 (1977-08-01), Tuller et al.
patent: 4219721 (1980-08-01), Kamen et al.
patent: 4340654 (1982-07-01), Campi
patent: 4444829 (1982-04-01), Bollen et al.
patent: 4460537 (1984-07-01), Heinle
patent: 4467172 (1974-08-01), Ehrenwald et al.
patent: 4515867 (1985-05-01), Bleacher et al.
patent: 4522656 (1985-01-01), Kuhn-Kuhnenfled et al.
patent: 4595647 (1986-06-01), Spanjer
Handy Robert M.
Kittle John E.
Motorola Inc.
Shah Mukund
LandOfFree
Laser markable molding compound, method of use and device theref does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laser markable molding compound, method of use and device theref, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser markable molding compound, method of use and device theref will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2212752