Laser machining of semiconductor materials

Details Laser machining of semiconductor materials Laser machining of semiconductor materials

2005-01-11

2005-01-11

Vinh, Lan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S662000, C216S065000

Reexamination Certificate

active

06841482

ABSTRACT:
A semiconductor is cut by directing a green laser beam of high power, and subsequently directing a UV beam along the cut line. The first beam performs cutting with relatively rough edges and a high material removal rate, and the second beam completes the cut at the edges for the required finish, with a lower material quantity removal.

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