Laser machining of molded assemblies

Details Laser machining of molded assemblies Laser machining of molded assemblies

1996-10-22

1999-11-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 174 521, 174 163, 174252, 361709, H05K 330

Patent

active

059877405

ABSTRACT:
A heat generating component is encapsulated within an encapsulant. A window is made in the encapsulant to expose a heat dissipating surface of the component and a heat sinking device is attached to the heat dissipating surface of the heat generating component. The window is formed using a laser.

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Howard Green et al., "Reducing MCM Fabrication Costs", Electronic Packaging & Production, pp. 50-54, May 1996.
Roland Heitmann, "The Ultimate Connections: BGA and Flip Chip Attachment", Electronic Packaging and Production, pp. 67-76, Electronic Packaging & Production, May 1996.
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Proceedings of 1996 International Electronics Packaging Conf. pp. 192-202 by T. Leniham et al, Published by Electron. Packaging Soc. Sep. 29-Oct. 1, 1996.

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