Laser machining

Details Laser machining Laser machining

2011-05-24

2011-05-24

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C257SE21238, C216S094000, C219S121690

Reexamination Certificate

active

07947575

ABSTRACT:
A method of laser machining a feature in a substrate includes machining the substrate with a pulsed laser along a scan line so that the successive pulses81at the substrate do not overlap but are either contiguous or spaced apart. Pulses82, 83, 84in respective succeeding scans of the laser along the scan line, are offset with respect to the starting point of pulses81, 82, 83in a previous scan so that multiple successive laser scans provide machining to a required depth while successively smoothing edges,91, 92, 93, 94of the feature with each pass.

REFERENCES:
patent: 6023040 (2000-02-01), Zahavi et al.
patent: 7528342 (2009-05-01), Deshi
patent: 7776720 (2010-08-01), Boyle et al.
patent: 7804043 (2010-09-01), Deshi
patent: 2005/0274702 (2005-12-01), Deshi
patent: 2006/0039419 (2006-02-01), Deshi
patent: 2006/0169677 (2006-08-01), Deshi
patent: 2009/0194516 (2009-08-01), Deshi
patent: 2010/0099239 (2010-04-01), Dunne et al.
patent: 2010/0197116 (2010-08-01), Shah et al.
patent: 99/34742 (1999-07-01), None
patent: 00/10037 (2000-02-01), None
patent: 02/34455 (2002-05-01), None

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