Laser irradiation apparatus for bonding and method of...

Details Laser irradiation apparatus for bonding and method of... Laser irradiation apparatus for bonding and method of...

2010-04-13

2011-12-06

Williams, Joseph L (Department: 2889)

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

Reexamination Certificate

active

08070546

ABSTRACT:
A laser irradiation apparatus for bonding a first substrate to a second substrate using bonding members and a method of manufacturing a display device using the same, the laser irradiation apparatus including a stage on which the first substrate is mounted, bonding members disposed between the first substrate and the second substrate, a laser oscillating member configured to irradiate a laser beam onto the bonding members, and a temperature maintaining member co-operating with the first substrate to maintain a temperature of the first substrate at a predetermined temperature.

REFERENCES:
patent: 2004/0040655 (2004-03-01), Yuasa
patent: 2007/0004232 (2007-01-01), Shareef et al.
patent: 2008/0295769 (2008-12-01), Kawagoe et al.
patent: 10235234 (2004-01-01), None
patent: 1925601 (2008-05-01), None
patent: 10-2007-0083148 (2007-08-01), None
patent: 10-0850808 (2008-08-01), None
patent: 10-2008-0111959 (2008-12-01), None
Office Action issued in corresponding Korean application, 10-2009-0038453, dated Jun. 22, 2011.

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