Laser interconnection of circuits on transparent substrate

Details Laser interconnection of circuits on transparent substrate Laser interconnection of circuits on transparent substrate

1993-08-04

1995-04-18

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427109, 427124, 427140, 427309, 427584, 427586, 427597, B05D 306

Patent

active

054077109

ABSTRACT:
The present invention relates to a method for the interconnection/repair of circuits on a transparent substrate at ambient temperature using laser induced chemical vapor deposition.

REFERENCES:
patent: 4543270 (1985-09-01), Oprysko et al.
patent: 4609566 (1986-09-01), Hongo et al.
patent: 4636404 (1987-11-01), Raffel et al.
patent: 4699801 (1987-10-01), Ito et al.
patent: 4711790 (1987-12-01), Morishige
patent: 4727234 (1988-02-01), Oprysko et al.
patent: 4758533 (1988-07-01), Magee et al.
patent: 4778693 (1988-10-01), Drozdowicz et al.
patent: 4822751 (1989-04-01), Ishizu et al.
patent: 4880959 (1989-11-01), Baum et al.
patent: 4902638 (1990-02-01), Muto
patent: 4938996 (1990-07-01), Ziv et al.
patent: 4948623 (1990-08-01), Beach et al.
patent: 4957880 (1990-11-01), Itoh et al.
patent: 4960729 (1990-10-01), Orbach et al.
patent: 4968643 (1990-11-01), Mukai
patent: 4976930 (1990-12-01), Kishida et al.
Kichnavek et al., "Laser Writing Metal Interconnect to Existing IC Metallization", SPIE vol. 1190, Optical Processing of Electronic Materials (1989) (no month avail.).
Ehrlich et al., J. Vac Sci. Technol., 21(1), May/Jun. 1982.
"Laser Deposition of Metal Films with Organo-Metal Ink", IBM Technical Disclosure Bulletin, vol. 31 No. 7, Dec. 1988.
Oprysko et al., "Nucleation Effects in Visible-Laser Chemical Vapor Deposition", Gould Research Center, J. Vac. Sci. Technol. B. 5 496 (1987) (no month avail.).

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