Laser interconnect process

Details Laser interconnect process Laser interconnect process

1988-10-04

1990-10-02

Beck, Shrive

Coating processes

Electrical product produced

Welding electrode

427 96, 427 97, 427229, 427123, B05D 306, B05D 512, B05D 302

Patent

active

049606131

ABSTRACT:
The uniformity of a catalyst layer produced by laser decomposition of a catalyst source compound is substantially improved for patterned substrates whose characteristics vary along the path of a conductor line by providing a buffer layer of a metal such as Ti, Cr or Ni over the substrate prior to the laser induced decomposition of the catalyst source compound.

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Cole, H. S. et al., "Laser Processing for Interconnect Technology", SPIE, vol. 877, Micro-Optoelectronic Materials (1988), pp. 92-96.
Cole, H. S. et al., "Laser-Induced Selective Copper Deposition on Polyimide", Applied Physics Letters, 53(21), Nov. 21, 1988, pp. 2111-2113.

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