Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-05-10
1997-08-26
Ryan, Patrick
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156298, 21912168, 36447408, B32B 900
Patent
active
056606680
ABSTRACT:
This invention relates to a novel computerized laser inlay and inlay printing process. More particularly, this invention pertains to a novel process for engraving by use of computer a first excavated image in an inlay base, and secondly engraving a second corresponding relief image on an inlay wafer, and then inlaying the second relief image of the inlay wafer in the first excavated image of the inlay base. A laser process for producing an inlay of one material in another material comprising: (a) electronically scanning an art master and recording a first positive image of the scanned art master in a computer; (b) coordinating a laser cutting beam with said scanned first positive image to engrave a hollow in a base corresponding in shape with said first positive image; (c) producing a second negative image by preparing a negative mirror image of the first positive image and recording the second negative mirror image in the computer; (d) coordinating the laser cutting beam with the scanned second negative mirror image to engrave a relief on an inlay corresponding in shape with the second negative mirror image; and (e) juxtaposing the relief of the inlay with the hollow in the base to form an inlay in the base.
REFERENCES:
patent: 3649806 (1972-03-01), Konig
patent: 4126500 (1978-11-01), Palanos
patent: 4139409 (1979-02-01), Macken et al.
patent: 4486371 (1984-12-01), Caliri
patent: 4530061 (1985-07-01), Henderson
patent: 4918611 (1990-04-01), Shyu
patent: 5103073 (1992-04-01), Danilov
patent: 5204759 (1993-04-01), Sakai
patent: 5284536 (1994-02-01), Gruber
Matheson Glenn David
Matheson Norma Catherine
Inland Laserwave Inc.
Jewik Patrick
Ryan Patrick
LandOfFree
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