Laser induced electrical connection of integrated circuits

Metal working – Method of mechanical manufacture – Electrical device making

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Details

21912185, 427 531, 437173, H05K 334

Patent

active

050521020

ABSTRACT:
Process for electrically connecting non-planar electronic elements to a motherboard. A radiation sensitive metallic conversion compound is applied as a coating which extends at least between electrical connection sites on the electronic element and motherboard. The metallic conversion coating is then selectively irradiated by laser to convert the coating into a metallic electrical connection which extends between the non-planar electronic element and motherboard.

REFERENCES:
patent: 3801366 (1974-04-01), Lemelson
patent: 4529090 (1985-06-01), Bottka et al.
patent: 4694138 (1987-09-01), Oodaira et al.
patent: 4778693 (1988-10-01), Drozdowicz et al.
patent: 4868068 (1989-09-01), Yamaguchi et al.

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