Laser exposure utilizing secondary mask capable of concentrating

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

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430396, 430397, 430945, G03F 900

Patent

active

060964618

ABSTRACT:
A method and apparatus for high resolution imaging of integrated circuits and flat panel displays uses a pulsed laser source, a thermoresist coated image receiving surface and a pair of masks. A primary mask carries the principal image and a secondary mask containing an array of lenslets which concentrate light from the source onto a subset of the features of the primary mask. The secondary mask lenslets are dimensioned so as to illuminate a subset of the features with a known pitch and form an image corresponding to the subset on the thermoresist. After creating a subset image, the secondary mask is moved so as to expose another subset of the features and form another subset image. In this manner, the entire principal image is reconstructed on the thermoresist from subset images. The secondary mask is moved on two axes by a plurality of piezo-electric actuators. Registration and position control of the secondary mask are accomplished by including positioning marks on the primary mask and a photo-detector to resolve the positioning marks and provide position feedback. To increase the power density imparted on the image receiving surface, the laser source may be focused into a concentrated scanning line, which is scanned across the secondary mask so as to further divide the imaging process, while providing additional power density.

REFERENCES:
patent: 4988188 (1991-01-01), Ohta
patent: 5059008 (1991-10-01), Flood et al.
patent: 5650876 (1997-07-01), Davies et al.
"Simulation and Experimental Evaluation of Double Exposure Thechnique" pp. 372-377 SPIE vol. 3334 (1998).
"New Method to Improve the Practical Resolution of Complex Pattern in Sub-half Micron Lithography" pp. 567-575 SPIE vol. 3334 (1998).

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