Laser enhanced plating for forming wiring patterns

Details Laser enhanced plating for forming wiring patterns Laser enhanced plating for forming wiring patterns

2007-11-06

2007-11-06

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S344000, C428S901000, C174S257000, C174S258000, C174S259000, C427S125000, C427S404000, C427S407100, C427S419100

Reexamination Certificate

active

10888450

ABSTRACT:
A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.

REFERENCES:
patent: 4080513 (1978-03-01), Cuneo et al.
patent: 4694302 (1987-09-01), Hackleman et al.
patent: 4711822 (1987-12-01), Choyke et al.
patent: 5114744 (1992-05-01), Cloutier et al.
patent: 5358604 (1994-10-01), Lin et al.
patent: 6156413 (2000-12-01), Tomari et al.
patent: 6265075 (2001-07-01), Klueppel et al.
patent: 6319564 (2001-11-01), Naundorf et al.
patent: 6515233 (2003-02-01), Labzentis et al.
patent: 6730857 (2004-05-01), Konrad et al.
patent: 6742250 (2004-06-01), Takahashi
patent: 6919514 (2005-07-01), Konrad et al.
patent: 2002/0076497 (2002-06-01), Chen
patent: 19723734 (1998-12-01), None
patent: 0 260 514 (1988-03-01), None
patent: 327399 (1989-08-01), None
patent: EP0260514 (1991-06-01), None
Concepcion, Arlene, “Electroless deposition of metals on paper using line patterning”,Proceedings of the National Conference on Undergraduate Research(NCUR), University of Wisconsin, Whitewater, (Apr. 25-27, 2002),1-5.
Fuller, Sawyer B., et al., “Ink-jet printed nanoparticle microelectromechanical systems”,Journal of Microelectromechanical Systems, 11(1), (Feb. 2002),54-60.
Gilleo, Ken , “Circuits Unusual: Time to Bring Back 3D Molded Circuits?”, http://www.circuitree.com/CDA/ArticleInformation/features/BNP—Features—Item/0,2133,106285,00.html, (Sep. 1, 2003),Website Article.
Huske, M , et al., “Laser supported activation and additive metallization of thermoplastics for 3D-MIDS”,Proceedings of the 3rd LANE 2001, (Aug. 28-31, 2001),1-12.
Jacobs, Heiko O., et al., “Approaching Nanoxerography: The Use of Electrostatic Forces to Position Nanoparticles with 100 nm Scale Resolution”,Advanced Materials, 14(21),(Nov. 2002),1553-1557.
Kaydanova, Tanya , et al., “Ink Jet Printing Approaches to Solar Cell Contacts”,NCPV and Solar Program Review Meeting 2003, NREL/CD-520-33586, p. 919,(2003),1-3.
LPKF Laser & Electronics, “LPKF MicroLine 3D IR Industrial”, http://www.lpkfusa.com/datasheets/mid/ml3d.pdf, Website—2 pages.
LPKF Laser & Electronics, “LPKF-LDS Process Description—Data Sheet”, http://www.lpkfusa.com/datasheets/mid/lds.pdf, Website—1-4.
Max Levy Online, “Flex Circuits and Metalized Film: Bulletin 1370A”, http://www.maxlevy.com/Bulletin1370Ap.cfm, Website Article.
Photonics Tech Briefs Online, “Miniaturization of Electronic Components:”, http://www.ptbmagazine.com/content/102002—lpkf.html. (Oct. 2002),Website Article.
Yang, H , et al., “Excimer laser-induced formation of metallic microstructures by electroless copper plating”,Journal of micromechanics and microengineering, 12(2), (Mar. 2002),157-161.

Affiliated with

Also associated with

Rating

Laser enhanced plating for forming wiring patterns does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser enhanced plating for forming wiring patterns, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser enhanced plating for forming wiring patterns will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3840830