Laser-enhanced jet-plating and jet-etching: high-speed maskless

Details Laser-enhanced jet-plating and jet-etching: high-speed maskless Laser-enhanced jet-plating and jet-etching: high-speed maskless

1983-06-13

1985-02-05

Tufariello, Thomas

Chemistry: electrical and wave energy

Processes and products

2041293, 2041296, 204224R, 204273, C25D 502, C25D 508, C25D 2110, C25F 302

Patent

active

044976925

ABSTRACT:
This metal deposition/material removal technique modifies free-standing or submerged jet plating with an electromagnetic energy beam such as an intense laser beam, directed collinearly along the jet. Experiments were made to deposit gold contact areas on nickel plated beryllium-copper substrates used for microelectronic connectors. The deposits are found to be crack-free and dense, possessing excellent adhesion to the substrate. Deposition rates for 0.05 cm diameter gold spots are on the order of 10 micrometers per second.

REFERENCES:
patent: 2799637 (1957-07-01), Williams
patent: 2846346 (1958-08-01), Bradley
patent: 2930949 (1960-03-01), Roschen
patent: 3039515 (1962-06-01), Figlio et al.
patent: 3345274 (1967-10-01), Schmidt
patent: 3486221 (1969-12-01), Robinson
patent: 3679863 (1972-07-01), Houldcroft et al.
patent: 3810829 (1974-05-01), Fletcher
patent: 3965328 (1976-06-01), Locke
patent: 4042006 (1977-08-01), Engl et al.
patent: 4217183 (1980-08-01), Melcher et al.
patent: 4283259 (1981-08-01), Melcher et al.
patent: 4390774 (1983-06-01), Steen et al.
patent: 4409458 (1983-10-01), Inoue

Affiliated with

Also associated with

Rating

Laser-enhanced jet-plating and jet-etching: high-speed maskless does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser-enhanced jet-plating and jet-etching: high-speed maskless , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser-enhanced jet-plating and jet-etching: high-speed maskless will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2081697