Laser discharge chamber passivation by plasma

Details Laser discharge chamber passivation by plasma Laser discharge chamber passivation by plasma

2005-07-05

2005-07-05

Harvey, Minsun Oh (Department: 2828)

Coherent light generators

Particular active media

Gas

C372S055000, C372S057000, C372S059000, C372S061000, C372S076000, C372S082000, C372S090000

Reexamination Certificate

active

06914927

ABSTRACT:
Methods and apparatus are provided for cleaning and passivating laser discharge chambers with plasmas. In one embodiment, an oxygen based plasma is formed in a plasma source external to the laser discharge chamber by applying a radiofrequency signal to oxygen containing gases. The oxygen based plasma is drawn into the laser discharge chamber, where it reacts with contaminants and cleans internal surfaces. After cleaning, a fluorine based plasma is formed in the plasma source and drawn into the laser discharge chamber to passivate internal surfaces. In another embodiment, cleaning with the oxygen based plasma is not used since some level of cleaning is accomplished with the fluorine based plasma. In another embodiment, oxygen based plasmas and fluorine based plasmas are formed in the laser discharge chamber by applying a radiofrequency signal to a laser discharge chamber electrode. Plasma cleaning and passivation of laser discharge chambers is safer, more efficient, and more effective than conventional thermal cleaning and passivation processes.

REFERENCES:
patent: 4890294 (1989-12-01), Nishimae et al.
patent: 5009963 (1991-04-01), Ohmi et al.
patent: 5047115 (1991-09-01), Charlet et al.
patent: 5360768 (1994-11-01), Ohmi et al.
patent: 5444259 (1995-08-01), Ohmi
patent: 5897847 (1999-04-01), Jursich et al.
patent: 6024885 (2000-02-01), Pendharkar et al.
patent: 0794 598 (1997-10-01), None
N. Maeno, et al., “Fluorine Passivation of Metal Alloy Surface With Volatile Reaction Enhanced mechanism,” (Jul. 1992) J. Electrochem. Soc., vol. 139, No. 7, pp. 1865-1869.
Phil Danielson, “Gas Loads From Elastomer Seals,” (Jan. 1999) Vacuum & Thinfilm, pp. 14-15.
Stella Chemifa Corporation, “Fluorine Passivation Technology,” (1998) 11 pages.
N. Maki et al., “Fluorine Passivation of Metal Surface for Self-Cleaning Semiconductor Equipment,” (Feb. 1990) IEEE Transactions on Semiconductor Manufacturing, vol. 3, No. 1, pp. 1-11.
M. Maeno et al., “Optimization of Fluorine Passivation of Stainless Steel Surfaces,” (May 1992) IEEE Transactions on Semiconductor Manufacturing, vol. 5, No. 2 pp. 107-113.
Hashimoto Chemical Corporation, “Fluroine Passivation Technology,” (1997) pp. 1-11.
Ultra Clean Manufacturing Technology Co., Ltd., “CRP & FP—Gas Supply System for the Next Generation of ULSI,” (Undated) 16 pages.
N. Miki et al., “Vapor-Liquid Equilibrium of the Binary System HF-H2O Extending to Extremely Anhydrous Hydrogen Fluoride,” (Mar. 1990) J. Electrochem. Soc., vol. 137, No. 3, ©The Electrochemical Society, Inc., pp. 787-790.
M. Maeno et al., “Fluorine-Passivated Electroless Ni-P Films,” (Oct. 1994) J. Electrochem. Soc., vol. 141, No. 10, ©The Electrochemical Society, Inc., pp. 2649-2654.
G.M. Jurisch et al., “Gas Contaminant Effects in Discharge-Excited KrF Lasers,” (Apr. 20, 1992) Applied Optics, vol. 31, No. 12, pp. 1974-1981.
W. Holber et al., “Reducing PFC Emissions From CVD Reactors,” (Mar. 1999) Vacuum & Thinfilm, pp. 26-29.
Future Fab International, “XPS Analysis on Fluorine Removal by Plasma Cleaning,” (Undated) pp. 289-293.
P.M. Clarke et al., “Gas-Phase Interactions Between WF6and Metal Surfaces,” (1994) Conference Proceedings ULSI-IX—Materials Research Society, pp. 411-417; 59 68.
Y. Shirai et al., “Fluorine Passivation of Metal Surface,” (1996) CleanRooms '96 West Session 602, pp. 68-71.
Phil Danileson, “Rate-of-rise Measurements,” (Nov./Dec. 1998) Vacuum & Thinfilm, pp. 12-13.
Vacuum & Thinfilm, “The Evolution of RF,” (Nov./Dec. 1998) pp. 30-33.
Y. Minamitani et al., “Characteristics of A Corona Reactor As A Gas Purifier For Excimer Lasers,” (Undated) pp. 1-18.
H.E. Litvak, “End Point Control Via Optical Emission Spectroscopy,” (1996) J. Vac. Sci. Technol. B14(1), pp. 516-520.
D.W. Greve et al., “Process Control Based On Quadrupole Mass Spectrometry,” (1996) J. Vac. Sci. Technol. B14(1), pp. 489-493.
Los Alamos National Laboratory, “Excimer Laser Chemical Problems,” (1985) U.S. Dept. of Commerce, 81 pages.
Kazuhide Ino et al., “Plasma Enhanced In Situ Chamber Cleaning Evaluated by Extracted-Plasma-Parameter Analysis,” (1996) IEEE Transaction on Semiconductor Manufacturing, vol. 9, No. 2, pp. 230-240.
Kenji Komine et al., “Residuals Caused by The CF4Gas Plasma Etching Process,” (May 1996) Jpn. J. Appl. Phys. vol. 35, pp. 3010-3014.
A.L. Cabrera et al., “Surface Analysis Of Copper, Brass, and Steel Foils Exposed to Fluorine Containing Atmospheres,” (1990) J. Vac. Sci. Technol. A8, pp. 3988-3996.
I. Kazuhide et al., “In Situ Chamber Cleaning Using Halogenated-Gas Plasmas Evaluated by Plasma-Parameter Extraction,” (Jan. 1994) Jpn. J. Appl. Phys. vol. 33, pp. 505-509.

Affiliated with

Also associated with

Rating

Laser discharge chamber passivation by plasma does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser discharge chamber passivation by plasma, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser discharge chamber passivation by plasma will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3379112