Laser, direct-write integrated circuit production system

Electric heating – Metal heating – By arc

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Details

21912173, 21912174, 21912175, 2191218, B23K 900

Patent

active

051091496

ABSTRACT:
A laser, direct-write system for making personalized custom or semi-custom integrated circuits with a very fast turnaround time. The system includes a method and apparatus for high percision scanning of a submicron laser spot. The laser beam is scanned at the entrance of a beam expander. The beam expander reduces the scan angle and error produced by a mechanical scanning device such as a rotating polygonal mirror. The smaller scan angle at the output of the beam expander matches well with the projection optics of a laser, direct-write semi-custom integrated circuit production system. The scan error reduction permits more accurate positioning of the focussed laser spot on the surface of the semi-custom integrated circuit.

REFERENCES:
patent: 4456812 (1984-06-01), Neiheisel et al.
"Two Interconnection Techniques for Large-Scale Circuit Integration", IBM Journal, Sep. 1967, pp. 520-526.
"Laser Speeds Gate-Array Hookup", Electronics Week/Feb. 4, 1985, pp. 21 and 24.

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