Laser diode with substrate-side protection

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing

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438462, H01L 21302

Patent

active

060135409

ABSTRACT:
A semiconductor optical device is formed to include a substrate-side dielectric barrier layer in the area where the substrate and facet meet. The dielectric is deposited on the substrate surface prior to cleaving of the facet and results in reducing the defects along the facet. The dielectric material also serves as a substrate-side "anchor" for the dielectric deposited on the facet, reducing the incidence of delamination of the dielectric coating from the facet.

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