Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Patent
1998-05-01
2000-01-11
Mulpuri, Savitri
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
438462, H01L 21302
Patent
active
060135409
ABSTRACT:
A semiconductor optical device is formed to include a substrate-side dielectric barrier layer in the area where the substrate and facet meet. The dielectric is deposited on the substrate surface prior to cleaving of the facet and results in reducing the defects along the facet. The dielectric material also serves as a substrate-side "anchor" for the dielectric deposited on the facet, reducing the incidence of delamination of the dielectric coating from the facet.
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Lucent Technologies - Inc.
Mulpuri Savitri
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