Laser diode structure with integrated heat sink

Details Laser diode structure with integrated heat sink Laser diode structure with integrated heat sink

1996-04-26

1998-04-28

Healy, Brian

Coherent light generators

Particular active media

Semiconductor

372 34, 372 50, H01S 318

Patent

active

057455147

ABSTRACT:
A laser diode structure includes a metallic gasket which is sandwiched between the laser diode submount and the backside electrode in the absence of solder interfaces. The gasket has mirror image, shallow recesses in the surfaces thereof with each surface having the general shape of a wing. The recesses are formed into sealed coolant conduits when the several layers are bonded together into an integrated structure. The narrow end of each recess communicates with an aperture through the adjacent layer to provide inlet and outlet ports for the coolant. The gasket has an aperture therethrough at the wide ends of the recesses for the coolant to circulate. The gasket can be formed from a single layer or from two layers each with a single recess.

REFERENCES:
patent: 4546478 (1985-10-01), Shimizu et al.
patent: 5052009 (1991-09-01), Tsuboi et al.
patent: 5197076 (1993-03-01), Davis et al.
patent: 5285462 (1994-02-01), Kasahara
patent: 5408493 (1995-04-01), Aoki
Modular Microchannel Cooled Heatsink for High Average Power Laser Diod Arrays R. Beach et al, IEEE Journal of Quantu Electronics, Jun. 1991.

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