Laser diode package with heat sink

Details Laser diode package with heat sink Laser diode package with heat sink

1996-04-30

1999-04-27

Graybill, David

Active solid-state devices (e.g., transistors, solid-state diode

Voltage variable capacitance device

Plural diodes in same non-isolated structure, or device...

257625, 257706, 257713, 257910, H01L 2993, H01L 2906, H01L 2310, H01L 2334

Patent

active

058982116

ABSTRACT:
A laser diode package includes a laser diode, a heat sink and a lid. The laser diode has an emitting surface, a reflective surface opposing the emitting surface, and first and second surfaces between the emitting surface and the reflective surface. The laser diode has a diode height defined between the emitting surface and the reflective surface. The heat sink has an interior surface, an exterior surface opposing the interior surface, a top surface and a base surface. The height of the heat sink is defined between the top surface and the base surface and is approximately less than four times the laser diode height. The first surface of the diode is attached to the interior surface of the heat sink with a first solder. The base surface of the heat sink is coupled to a thermal reservoir. The lid is attached to the second surface of the laser diode via a second solder. An upper end of the lid is near the emitting surface of the laser diode. A lower end of the lid is typically slightly below the reflecting surface of the laser diode. A plurality of laser diode packages are grouped together to form an array. The heat sink of each of the laser diode packages is attached to a backplane which is then connected to a thermal reservoir.

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