Laser diode package

Details Laser diode package Laser diode package

1998-01-05

1999-05-11

Bovernick, Rodney

Coherent light generators

Particular active media

Semiconductor

372 36, 372 33, H01S3/04;3/18;3/00

Patent

active

059035846

ABSTRACT:
A surface-mounted flat package for a laser diode has the laser diode and light sensor diode mounted on top of a printed wiring insulating substrate. These diodes are connected to electrodes at the corners of the package. These electrodes may be fed through plated through via holes to form bottom electrodes. These via holes may be located at the four corners of the substrate or inside the edges of the package.
For mass production, a matrix of laser diode and sensor diode assemblies are mounted on a common substrate. The substrate is sawed orthogonally through or outside the via holes to yield a large number of dice.

REFERENCES:
patent: 4736231 (1988-04-01), Ayabe et al.
patent: 4764931 (1988-08-01), Matsuda
patent: 5052005 (1991-09-01), Tanaka et al.

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