Laser diode component with heat sink and method of producing a p

Coherent light generators – Particular temperature control – Heat sink

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372 43, H01S 304, H01S 318

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058125701

ABSTRACT:
A laser diode component includes a semiconductor body secured on a heat sink which includes a dissipator and an electrically and thermally conductive connection plate. The semiconductor body is secured to the connection plate, which in turn is applied to the dissipator. The connection plate is formed of a material having a coefficient of thermal expansion that is similar to the coefficient of thermal expansion of the semiconductor material of the semiconductor body. A connecting layer between the semiconductor body and the connection plate is preferably formed of hard solder. The dissipator is secured to the connection plate, for example through the use of a thermally conductive adhesive. A method for producing a plurality of laser diode components includes making many such laser diode components as a unit, and then subsequently cutting them apart.

REFERENCES:
patent: 5234153 (1993-08-01), Bacon et al.
patent: 5299214 (1994-03-01), Nakamura et al.
Japanese Patent Abstract No. 59-172787 (Ootsuka), dated Sep. 29, 1994.
Japanese Patent Abstract No. 59-172786 (Ootsuka), dated Sep. 29, 1994.

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