Laser diode array packaging

Coherent light generators – Particular active media – Semiconductor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

372 43, 372 36, H01S 318, H01S 304, H01S 319

Patent

active

058355189

ABSTRACT:
A method of packaging laser diode arrays includes the steps of forming a submount array having a plurality of submounts and an element for maintaining a precise spacing between the submounts; bonding the submounts to a substrate formed of an electrically insulating material; removing the element maintaining the precise spacing; and placing a diode bar in each of the precise spacings between adjacent submounts. For one embodiment of the invention, the submount array is formed by providing a plurality of submounts and a removable spacer between each pair of adjacent submounts, which spacers may be fixtured and are removed after the submounts are bonded to the substrate. For a second embodiment, the submount array is formed by machining a block of material from which submounts are to be formed into a plurality of submounts joined to each other by at least one attachment structure. After the submounts have been bonded to the substrate, the attachment structures may be machined away of otherwise removed. For the second embodiment, the submount array may have additional structures which may be used for alignment, mounting or other functions and selected features, able for a variety of functions, may be formed in such additional structures or in the submounts. The additional structures are secured to the submount array by attachment structures. One or more of the additional structures may be bonded to the substrate and will remain on the substrate when the attachment structures are removed.

REFERENCES:
patent: 4716568 (1987-12-01), Scifres et al.
patent: 4881237 (1989-11-01), Donnelly
patent: 5031187 (1991-07-01), Orenstein et al.
patent: 5040187 (1991-08-01), Karpinski
patent: 5128951 (1992-07-01), Karpinski
patent: 5284790 (1994-02-01), Karpinski
patent: 5305344 (1994-04-01), Patel
patent: 5311535 (1994-05-01), Karpinski
patent: 5357536 (1994-10-01), Andrews
patent: 5420722 (1995-05-01), Bielak
patent: 5526373 (1996-06-01), Karpinski

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Laser diode array packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser diode array packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser diode array packaging will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1524796

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.