Electric heating – Metal heating – By arc
Patent
1997-06-05
1999-03-23
Evans, Geoffrey S.
Electric heating
Metal heating
By arc
B23K 2600
Patent
active
058863133
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND AND SUMMARY OF THE INVENTION
The invention relates to a device for bonding two or more metal plates, strips, and the like by absorption of energy from laser radiation, provided by beam-forming optical means.
Devices for bonding are known of themselves. In bonding operations, high-quality coating materials that possess particular chemical, physical, or mechanical properties are bonded with inexpensive base materials that contribute strength. It is necessary to achieve a strong metallic connection between the coating material and the base material. In the past this has been accomplished by squeezing the coating material onto the base material in a plastic state. The energy required for this purpose is applied for example by rolling or explosions in the bonding zone.
Bonding is used to produce semifinished products composed for example of two or more metal layers bonded together by the methods of cold-roll bonding, hot-roll bonding, explosive bonding, or a combination of these bonding methods. The semifinished products are therefore called bonded materials and belong to the class of layer bonded materials. The metal layers of the coating material and base material are usually much thicker than those employed in conventional surface treatment methods. In bonded layered materials the technical and economical properties of their components are combined in such fashion that suitability for the purpose is obtained that is superior to that of the individual materials.
In hot-roll bonding or cold-roll bonding, average to high rolling pressures on the order of 10.sup.2 N/mm.sup.2 or 10.sup.4 N/mm.sup.2 are used. The sheet widths that can be bonded in this fashion are less than 0.6 m. In explosive bonding, an explosive pressure of 10.sup.5 -10.sup.6 N/mm.sup.2 is used. Important disadvantages of explosive bonding however include the wavy structure of the bonding zone between the coating material and the base material and a sheet width of 3 meters or more.
One disadvantage of cold rolling bonding and hot rolling bonding is the fact that only metal plates with widths up to 60 cm can be processed. In addition, in hot-roll bonding and cold-roll bonding, the high roller pressures already mentioned must be used, resulting in a corresponding cost of machinery and energy. In the hot-roll bonding method, the coating material and base material are heated to 1200.degree. C. so that a change takes place in the metallurgical and mechanical properties of the materials.
A device and a method for bonding using laser radiation is known from German Patent 37 13 975. The device disclosed therein and the corresponding method are proposed in particular for welding the edges of workpieces, but are also intended to perform bonding of layered materials. In German Patent 37 13 975 the device uses laser radiation that is particularly suited for heating the surfaces of two layered materials fitted together at a V-shaped gap. This laser radiation runs essentially parallel to the plane of the gap of the joint and perpendicular to the line of the joint. In addition, the laser radiation oscillates primarily parallel to the plane of the gap of the joint. According to the subject of German Patent 37 13 975, the surfaces of the two materials to be joined are brought closer and closer together to produce the joint. A welded seam extends from this joint, with the surfaces of the materials to be joined being welded together in the vicinity of the welded seam by the melting of the materials. The surfaces of the materials are brought together by applying pressure in the vicinity of the joint. In the area of the joint itself, the surfaces of the materials abut one another with practically zero pressure so that the molten material of the two material surfaces is under practically no joining pressure. The method for joining two metal layers according to German Patent 37 13 975 makes sense for welding but not for bonding involving two metal layers. In bonding, the surfaces of the two metal layers to be joined are not heated to the melting point, an
REFERENCES:
patent: 4744615 (1988-05-01), Fan et al.
patent: 4912297 (1990-03-01), Beyer et al.
patent: 4963714 (1990-10-01), Adamski et al.
patent: 5068515 (1991-11-01), Van der Bergh et al.
patent: 5306890 (1994-04-01), Minamida et al.
patent: 5414559 (1995-05-01), Burghardt et al.
patent: 5548444 (1996-08-01), McLaughlin et al.
patent: 5705788 (1998-01-01), Beyer et al.
Beyer Eckhard
Krause Volker
Treusch Hans-Georg
Vitr Gilbert
Wissenbach Konrad
Evans Geoffrey S.
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung
LandOfFree
Laser diode array device for bonding metal plates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laser diode array device for bonding metal plates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser diode array device for bonding metal plates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2128334