Laser deposition method and apparatus

Coating processes – Electrical product produced – Welding electrode

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Details

427250, 427124, 118726, 118 501, 118641, B05D 306, B05D 512, C23C 1600, C23C 1400

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active

051261650

ABSTRACT:
For forming a metal film of a desired property on a substrate, a target and the substrate are placed in a pressure-reducing chamber, and then pulse laser is irradiated to the target. This causes the component materials, such as ions, electrons, neutral atoms, cluster, fine grains and liquid drops, of the target to be emitted from the target, and then laser induced plasma is produced. These emissions of substances have spatial and timewise distribution determined by physical and chemical states. Then, a shielding plate having an opening is placed between the target and the substrate, and from the materials, only the material emitted in a predetermined direction is selected to control the property of the film deposited on the substrate. By locating a filter between the target and the substrate to open for a predetermined period of time, only the material emitted at a predetermined velocity can be selected. Further, by applying a predetermined d.c. voltage between the target and the substrate to control the spatial and timewise distribution of charged particles in the emitted materials, it is possible to control the velocity, order and quantity of the charged particles as the latter arrive at the substrate.

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