Laser decapsulation method

Details Laser decapsulation method Laser decapsulation method

2008-01-08

2008-01-08

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S940000, C257SE21521

Reexamination Certificate

active

11616617

ABSTRACT:
A decapsulation apparatus100has a laser8that removes plastic encapsulant from a device24. Chamber20is sealed. Exhaust port9removes debris and fumes. The device24is positioned and scanned using an X, Y table2. A hinged end4rotates the device to an acute angle of incidence with respect to a laser8.Endpoint detector10senses the exposed integrated circuit and moves or shuts down the laser8.

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