Laser decapsulation method

Details Laser decapsulation method Laser decapsulation method

2011-03-01

2011-03-01

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S940000, C257SE21521

Reissue Patent

active

RE042193

ABSTRACT:
A decapsulation apparatus100has a laser8that removes plastic encapsulant from a device24.Chamber20is sealed. Exhaust port9removes debris and fumes. The device24is positioned and scanned using an X, Y table2.A hinged end4rotates the device to an acute angle of incidence with respect to a laser8.Endpoint detector10senses the exposed integrated circuit and moves or shuts down the laser8.

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Carter, George, “Laser Decapsulation of Transfer Molded Plastic Packages for Failure Analysis”, “Proceedings from the 28th International Symposium for Testing and Failure Analysis”, 2002, Publisher: ASM International, Published in: Phoenix, AZ.

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