Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1988-12-30
1989-10-31
Godici, Nicholas P.
Metal fusion bonding
Process
With condition responsive, program, or timing control
228105, 228163, 228264, 228 9, 228 19, 21912165, 21912166, 21912182, 21912183, B23K 2600, B23K 2604, B23K 2606
Patent
active
048771759
ABSTRACT:
A solder bridge between leads of a microelectronic circuit is removed by projecting a laser beam onto the solder bridge with sufficient power to cause the solder forming the bridge to melt and to flow onto a wicking tool placed into contact with the solder bridge. The wicking tool is removed during the heating to remove the solder and debridge the leads. Microelectronic leads having a width of the order of 4 mils and a pitch of the order of 8 mils may be debridged easily using the invention.
REFERENCES:
patent: 3717742 (1973-02-01), Fottler
patent: 4564736 (1986-01-01), Jones et al.
patent: 4657169 (1987-04-01), Dostoomian
patent: 4676586 (1987-06-01), Jones et al.
patent: 4681396 (1987-07-01), Jones
Batra Prem N.
Jones Marshall G.
Beulick John S.
Davis Jr. James C.
General Electric Company
Godici Nicholas P.
Heinrich Samuel M.
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