Electric heating – Metal heating – By arc
Patent
1991-10-22
1993-10-05
Ball, Michael W.
Electric heating
Metal heating
By arc
29840, 156382, 156497, 228 42, 228219, 228220, B23K 2612, B23K 2614
Patent
active
052507815
ABSTRACT:
A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving the atmosphere cover (1) upwards and downwards related to the base (16), pressing means (2) and (3) provided in the atmosphere cover (1) for pressing the semiconductor device (5) toward the printed circuit board (7), and laser heating means (9) for bonding a lead terminal (6) of the semiconductor device (5) with a junction (7a) of the printed circuit board (7). The laser heating means (9) irradiates laser light (9a) through the atmosphere cover (1) to bonding agent (8) applied between a junction (6a) of the lead terminal (6) of the semiconductor device (5 ) and the junction (7a) of the printed circuit board (7), and heats and fuses the bonding agent (8) to bond both the junctions without touching the junctions thereof. Also, inside the atmosphere cover (1), atmosphere gas supplying means (1d), (1e), (1f) and (1g) are provided for supplying atmosphere gas (4) which is employed for preventing oxidation in the bonding.
REFERENCES:
patent: 4552300 (1985-11-01), Zovko et al.
patent: 4774392 (1988-09-01), Orita
patent: 4906812 (1990-03-01), Nied et al.
patent: 4937006 (1990-06-01), Bickford et al.
patent: 4978834 (1990-12-01), Griffaton
patent: 5113581 (1992-05-01), Hidese
Kanda Makoto
Yoshida Masaharu
Ball Michael W.
Mitsubishi Denki & Kabushiki Kaisha
Yoder Michele K.
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