Laser bond header

Details Laser bond header Laser bond header

1993-09-30

1996-08-13

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

With grounding means

174 525, 29879, 257692, H01L 2158

Patent

active

055458467

ABSTRACT:
The invention is to a header for a power semiconductor device and a method for making the header. A ground pin is mounted or formed on the header mounting base and a header ground lead is placed over the ground pin and fused to the pin by a laser beam.

REFERENCES:
patent: 3643006 (1972-02-01), Ance
patent: 4453033 (1984-06-01), Duff et al.

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