Laser-blown links

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357 71, H01L 2702, H01L 2348

Patent

active

048537586

ABSTRACT:
An improved technique for blowing conductive links with a laser provides for a wider range of acceptable laser energies. The link in an upper interconnect level is placed on a pedestal, typically formed by etching away a thin layer of the underlying dielectric on which the conductive link is formed. A link in a lower interconnect level thereby has the thickness of the dielectric overlying it reduced. This has been found to reduce the minimum laser energy required to cleanly blow the links in both levels and to reduce the effect of link orientation on the required laser energy.

REFERENCES:
patent: 4228528 (1980-10-01), Cenker et al.
patent: 4455194 (1984-06-01), Yabuet et al.
patent: 4503315 (1985-03-01), Kamioka et al.
patent: 4547830 (1985-10-01), Yamauchi
IBM Technical Disclosure Bulletin, vol. 22, No. 5, Oct. 1979, pp. 1971-1972, New York, US; B. K. Aggarwal et al.; "Laser Cutting Metal Through Quartz", *Whole Article*.
Patent Abstracts of Japan, vol. 7, No. 103 (E-173) [1248], May 6, 1983; & JP-A-58 23 475 (Fujitsu K.K.), 12-02-1983, *Abstract; Figures*.
Patent Abstracts of Japan, vol. 8, No. 81 (E.sup.3 238) [1518], Apr. 13, 1984; & JP-A-59 957 (Fujitsu K.K.), 06-01-1984, *Abstract; Figures*.

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