Laser-based termination of passive electronic components

Details Laser-based termination of passive electronic components Laser-based termination of passive electronic components

2006-05-30

2006-05-30

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Miscellaneous

C438S460000

Reexamination Certificate

active

07053011

ABSTRACT:
Terminating the ends of passive electronic components entails applying a laser-ablative coating to each of the opposed major surfaces of a substrate. A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-ablative coating from multiple selected regions of the major surfaces is directed for incidence on the substrate. Relative motion between the UV laser beam and substrate effects removal of sufficient amounts of laser-ablative coating to expose the multiple selected regions of the opposed major surfaces. The substrate is then broken into multiple rowbars, each of which includes side margins along which are positioned different spatially aligned pairs of the selected regions of the opposed major surfaces. An electrically conductive material is applied to the side margins to form electrically conductive interconnects between each spatially aligned pair of the selected regions.

REFERENCES:
patent: 4928254 (1990-05-01), Knudsen et al.
patent: 5863331 (1999-01-01), Braden et al.
patent: 6555447 (2003-04-01), Weishauss et al.
patent: 2003/0231457 (2003-12-01), Ritter et al.
patent: 2004/0090732 (2004-05-01), Ritter et al.

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