Laser-based technique for producing and embedding...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S825000, C029S829000

Reexamination Certificate

active

06986199

ABSTRACT:
A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.

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A. Piqué, C.B. Arnold, B. Pratap, R.C.Y. Auyeung, H.S. Kim and D.W. Weir, “Laser Direct-Write of metal patterns for interconnects and antennas” SPIE Proc. vol. 4977, p. 60.
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