Laser bar cleaving apparatus

Details Laser bar cleaving apparatus Laser bar cleaving apparatus

1998-05-01

2000-04-11

Wilczewski, Mary

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

438 68, 438 69, 438113, 438460, 438462, 438464, H01L 21302

Patent

active

06048747&

ABSTRACT:
A cleaving apparatus for separating a wafer (or bar) bar of optical devices into separate bars (or individual optical devices) comprises a relatively thin wire, preferably tungsten. The wire is forced against the underside of the bar directly underneath the location of a top side scribe mark. The wire, having a highly uniform, well-controlled radius of curvature, induces a known, reproducible stress through the body of the bar and nucleates a cleavage crack under the scribe mark. A force applied to the top surface of the bar will allow the cleaving crack to propagate cleanly along a single crystal surface through the depth of the bar to the location of the wire.

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