Laser alignment target for semiconductor integrated circuits

Details Laser alignment target for semiconductor integrated circuits Laser alignment target for semiconductor integrated circuits

1992-10-15

1994-03-15

Evans, F. L.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

G01B 1100

Patent

active

052949753

ABSTRACT:
An alignment target for use in aligning a semiconductor wafer using a scanning light beam includes a light reflective surface of a first material such as aluminum which defines an alignment pattern and a light scattering surface of a second material abutting the light reflective surface, the light scattering surface including a raised pattern of generally orthogonal lines with the lines having inclined sidewalls which scatter impinging light. In a preferred embodiment the second material is polycrystalline silicon which has been etched to form the pattern with inclined sidewalls.

REFERENCES:
patent: 3660157 (1972-05-01), Villers et al.
patent: 4632557 (1986-12-01), Thompson
patent: 4824254 (1989-04-01), Ohtsuka et al.
Patent Abstracts of Japan, vol. 7, No. 186 (E193), Aug. 16, 1983, Abstract of 58-90728.
Patent Abstracts of Japan, vol. 11, No. 190, (E517), Jun. 18, 1987, Abstract of 62-18714.
Patent Abstracts of Japan, vol. 13, No. 251 (E771) Jun. 12, 1989, Abstract of 01-50528.
Patent Abstracts of Japan, vol. 14, No. 187 (E0917) Apr., 16, 1990, Abstract of 02-36523.

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