Laser ablation mask and method of fabrication

Details Laser ablation mask and method of fabrication Laser ablation mask and method of fabrication

1995-12-08

1996-11-12

Rosasco, S.

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

430313, 1566591, 428141, G03F 900

Patent

active

055738753

ABSTRACT:
A laser ablation mask and a method of fabrication therefor. The mask has a pattern of clear areas and scattering areas. The scattering areas are covered with randomly formed facets. The facets act as scattering centers. Areas clear of facets transmit laser energy. Scattering areas refract laser energy. Laser energy directed at the mask, will pass through the clear mask areas to selectively ablate an organic layer placed opposite the mask. However, laser energy is scattered when striking and passing through the scattering areas such that insufficient laser energy passes directly through the mask to reach the organic layer for ablation to occur. The mask is formed by depositing and patterning a metal mask layer on a quartz plate. The patterned mask layer protects intended clear areas. Scattering areas are formed in unprotected plate areas by subjecting the plate to a polymethacrylic acid/bifluoride solution.

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W. M. Moreau, et al., "Dielectric Photomasks" IBM Technical Disclosure Bulletin, vol. 13, No. 1, p. 158, Jun. 1970.
Anonymous, "Controlling Sidewall Angle on Laser Ablated Holes" Research Disclosure, No. 336, Apr. 1992.

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