Laser ablation forward metal deposition with electrostatic assis

Electric heating – Metal heating – By arc

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427469, 427555, 427597, 174250, B23K 2600

Patent

active

056836015

ABSTRACT:
Apparatus and method for metal line deposition on a substrate. Laser ablation of a metal film coated on a first substrate removes metal ions from the film. The ions travel forward to a surface of a second substrate disposed opposite the metal film on the first substrate and are deposited on the second substrate. A positive electrode on the first substrate, a negative electrode on the second substrate, and a power supply create an electric field that is simultaneously applied across the first and second substrates. The positively charged ions in the second substrate migrate toward the negative electrode of the electric field, leaving a surplus of negatively charged ions at the surface of the second substrate. The negative ions in the second substrate electrostatically bond with the positively charged ablated metal ions, thereby assisting the bonding of metal lines to the substrate. The power of the laser used during ablation and the position of a sample stage on which the second substrate is supported may be controlled by a computer to deposit metal line patterns on the second substrate.

REFERENCES:
patent: 3560258 (1971-02-01), Brisbane
patent: 3781978 (1974-01-01), Intrator et al.
patent: 4349583 (1982-09-01), Kulynych et al.
patent: 4622058 (1986-11-01), Leary-Renick et al.
patent: 4714628 (1987-12-01), Eloy
patent: 4725877 (1988-02-01), Brasen et al.
patent: 4734550 (1988-03-01), Imamura et al.
patent: 4752455 (1988-06-01), Mayer
patent: 4758388 (1988-07-01), Hamada et al.
patent: 4895735 (1990-01-01), Cook
patent: 4933204 (1990-06-01), Warren, Jr. et al.
patent: 4987006 (1991-01-01), Williams et al.
patent: 4987007 (1991-01-01), Wagal et al.
patent: 5057184 (1991-10-01), Gupta et al.
patent: 5079070 (1992-01-01), Chalco et al.
patent: 5141602 (1992-08-01), Chen et al.
patent: 5153408 (1992-10-01), Handford et al.
patent: 5173441 (1992-12-01), Yu et al.
patent: 5175504 (1992-12-01), Henley
patent: 5177594 (1993-01-01), Chance et al.
patent: 5203929 (1993-04-01), Takayanagi et al.
patent: 5235272 (1993-08-01), Henley
patent: 5246745 (1993-09-01), Baum et al.
patent: 5330968 (1994-07-01), Nagaishi et al.
patent: 5492861 (1996-02-01), Opower

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Laser ablation forward metal deposition with electrostatic assis does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser ablation forward metal deposition with electrostatic assis, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser ablation forward metal deposition with electrostatic assis will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1830422

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.