Large scale protrusion membrane for semiconductor devices under

Details Large scale protrusion membrane for semiconductor devices under Large scale protrusion membrane for semiconductor devices under

1993-01-14

1995-06-06

Nguyen, Vinh

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

G01R 106

Patent

active

054225744

ABSTRACT:
An embodiment of the present invention is a probe membrane with a center contact bump area and a plurality of signal connection sections separated by triangular reliefs in the membrane and terminating in a tangential row of contacts for wire bonding to a probe card. The system of triangular reliefs in the membrane allows the membrane to be puckered up such that the center contact bump area is raised approximately ninety mils above the general plane of the probe card. When the membrane has been fixed in its puckered up position, the triangular reliefs in the membrane form several radial rectangular slits. A translator gimbal attached to the center of the membrane provides stability and contact force for the contact bumps to a DUT. Areas of transparency in the vicinity of the contact bump area allows a user to view the I/O pads of a DUT for alignment with the contact bumps in the membrane.

REFERENCES:
patent: 4906920 (1990-03-01), Huff et al.
patent: 4912390 (1990-03-01), Greub et al.
patent: 4918383 (1990-04-01), Huff et al.
patent: 4922192 (1990-05-01), Gross et al.
patent: 4975638 (1990-12-01), Evans et al.
patent: 4980637 (1990-12-01), Huff et al.

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