Large scale integrated focal plane

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Details

357 65, 357 68, 357 83, 357 24, H01L 2714, H01L 2978, H01L 2348, H01L 2504

Patent

active

044518420

ABSTRACT:
A photo-electric sensor comprised of a wafer of semiconductor material with a first plurality of photodetectors integral with its rear surface, its front surface being an electrode comprised of a transparent layer of electrically conductive material, has those detectors so spaced apart from each other that the total array can be sampled by a second plurality of charge coupled device multiplexers, each of which multiplexers has its input terminals spaced closer together than are the photodetectors. Each multiplexer input terminal is mechanically and electrically coupled to a photodetector through metallic leads and columns, such leads and columns being so configured as to preclude obtrusion of multiplexer structure into space outside the wafer's lateral extremities, which results in no "dead" space in a focal plane consisting of either one sensor or a plurality thereof abutting each other.

REFERENCES:
patent: 3989946 (1976-11-01), Chapman et al.
patent: 4197469 (1980-04-01), Cheung
patent: 4246590 (1981-01-01), Thomas et al.
patent: 4369458 (1983-01-01), Thomas et al.

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