Large scale integrated circuit production

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29591, H01L 2190

Patent

active

042863740

ABSTRACT:
A method of forming connection networks for an integrated circuit device, by forming an orthogonal array of grooves in a substrate, with the grooves of one array deeper than those of the other array; and by providing conductive strips at the bottoms of the grooves and at selected regions of the groove side walls which strips serve to provide a desired pattern of interconnections.

REFERENCES:
patent: 3781975 (1974-01-01), Ressel et al.
patent: 4197633 (1980-04-01), Lorenze et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Large scale integrated circuit production does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Large scale integrated circuit production, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Large scale integrated circuit production will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1669612

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.