Large scale integrated circuit package

Details Large scale integrated circuit package Large scale integrated circuit package

1985-04-18

1988-06-28

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 36, 174 685, 361408, 361414, H05K 109

Patent

active

047543710

ABSTRACT:
A large scale integrated circuit package is described wherein insulating layers of an organic material are provided between wiring layers to reduce the characteristic impedance of signal wiring. To avoid deformation of the organic insulating layers and subsequent damage to wiring layers, leads for connecting the circuits of an integrated circuit chip to electrode pads are mechanically connected to the electrode pads on an upper layer of organic insulating material by a gold-tin eutectic alloy.

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