Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-08-22
2000-01-25
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361736, 361760, 361783, 361792, 257700, 257704, 257723, 438124, H01L 23538, H05K 111
Patent
active
060184639
ABSTRACT:
A large non-hermetic packaging approach that produces a large multichip module or SuperMCM package. The present invention integrates a plurality of multichip module technologies including removable and/or standard high density multilayer interconnect (HDMI) decal substrates, and a reworkable chip on board coating, housed in a mechanically sound, thermally conductive non-hermetic multichip package. A metal substrate has an HDMI substrate and one or more edge printed wiring boards bonded thereto which are interconnected using wire bonds. The HDMI substrate has one or more electronic chips bonded thereto that are connected thereto using wire bonds or other attachment scheme. Components on the one or more edge printed wiring boards are connected to the using edge printed wiring boards wire bonds. The edge printed wiring boards have external attachment pads exposed at their outside edges. A removable cover is disposed over the package except for the external attachment pads at the edges of the package.
REFERENCES:
patent: 5168344 (1992-12-01), Ehlert et al.
patent: 5280413 (1994-01-01), Pai
patent: 5315486 (1994-05-01), Fillion et al.
patent: 5488256 (1996-01-01), Tsunoda
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5600181 (1997-02-01), Scott et al.
patent: 5751554 (1998-05-01), Williams et al.
patent: 5764484 (1998-06-01), Hoffman et al.
patent: 5834705 (1998-11-01), Jonaidi
patent: 5869894 (1999-02-01), Degani et al.
Electronic Materials and Processes Handbook, 2nd ed., Harper & Sampson eds., McGraw-Hill, Inc.: Metals by Harrison et al., pp. 5.1,5.5,5.6; Thin and Thick Films by Licari, pp. 8.1,8.18-8.20, 1994.
Tansavatdi Manny
Winslow David T.
Alkov Leonard A.
Lenzen, Jr. Glenn H.
Picard Leo P.
Raytheon Company
Vigushin John B.
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