Large line conductive pads for interconnection of stackable...

Details Large line conductive pads for interconnection of stackable... Large line conductive pads for interconnection of stackable...

2005-03-08

2005-03-08

Picardat, Kevin M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S739000, C257S773000

Reexamination Certificate

active

06864576

ABSTRACT:
Digital circuitry, such as interconnective pads which are patterned as waffles according to the embossing methods for flexible substrates which are disclosed, so as to be especially suited for the interconnection of stacks of circuitry blocks forming digital memory known as Permanent Inexpensive, Rugged Memory (PIRM) cross point arrays.

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Juskey F et al. “Cross Hatched Pad Design for Bonding EI Panels to PCB's usng Z-Axis Adhesives” Mootorola Tech. Develop., Motorola Inc. Schaumburg, IL., US. vol. 19 Jun. 1, 1993.

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