Large array MMIC feedthrough

Details Large array MMIC feedthrough Large array MMIC feedthrough

1990-06-08

1992-07-21

LaRoche, Eugene R.

Wave transmission lines and networks

Plural channel systems

Having branched circuits

333136, 333247, 343853, 361414, H01P 512, H05K 714

Patent

active

051326485

ABSTRACT:
A method and apparatus are disclosed for manufacturing large Monolithic Microwave Integrated Circuit (MMIC) arrays. MMIC elements are manufactured on a substrate to form a MMIC module and first conductive vias are created in the substrate at locations corresponding to contact points for the MMIC. The MMIC module is then secured to a multi-layered ceramic backplate structure for physical rigidity and electrical interconnection. The MMIC module uses a conductive material, such as chrome, to fill or coat the vias to provide electrical contact with MMIC contact pads. Each layer of the multi-layered backplate structure has an electrical interconnection circuit or network formed thereon, and conductive vias extending through the layer at locations corresponding to preselected vias in adjacent layers and electrical contacts for MMIC modules. In further aspects of the invention, portions of the backplate also support phase control integrated circuit logic elements or devices which are electrically connected to the MMICs through the interconnection circuits to reduce off-structure connections. The backplate uses a multi-layer hybrid technique in conjunction with the via holes on the MMIC substrate to form a low cost and reliable feeding network for a large MMIC array, such as a phased-array. The invention uses RF power distribution structures in combination with advanced fabrication and assembly techniques to eliminate individually fabricated RF feedthroughs.

REFERENCES:
patent: 3777220 (1973-12-01), Tatusko et al.
patent: 4371744 (1983-02-01), Badet et al.
patent: 4407007 (1983-09-01), Desai et al.
patent: 4636755 (1987-01-01), Gibbs
patent: 4724283 (1988-02-01), Shimada et al.
patent: 4725925 (1988-02-01), Tanaka et al.
patent: 4821142 (1989-04-01), Ushifusa et al.
patent: 4837408 (1989-06-01), Kondo et al.
patent: 4899118 (1990-02-01), Polmski, Sr.
patent: 4907128 (1990-03-01), Solomon et al.
patent: 4922377 (1990-05-01), Matsumoto et al.
patent: 4929959 (1990-05-01), Sorbello et al.
Mcllvenna, "Monolithic Phased Arrays for EHF Communications Terminals", Microwave Journal, Mar. 1988, pp. 113-117, 121-124.

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