Large array heater chips for thermal ink jet printheads

Details Large array heater chips for thermal ink jet printheads Large array heater chips for thermal ink jet printheads

1996-11-20

1998-02-17

Hecker, Stuart N.

Incremental printing of symbolic information

Ink jet

Ejector mechanism

347 63, 216 27, 438 21, B41J 205, H01L 2100

Patent

active

057196052

ABSTRACT:
An increased resolution thermal ink jet printhead construction and method for forming large array heater chips for thermal ink jet printheads is achieved by fabricating a unitary "megachip" in which multiple cells of electrical components are defined in a plurality of columnar patterns in a plane of a silicon wafer. Cells of a first column are vertically offset from cells of an adjacent column so as to overlap the gap between cells in the first column. The megachip is then formed by grouping at least one cell from each of two adjacent columns and dicing the wafer to remove the megachip.

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