Radiant energy – Invisible radiant energy responsive electric signalling – Semiconductor system
Reexamination Certificate
1998-07-07
2001-01-30
Hannaher, Constantine (Department: 2878)
Radiant energy
Invisible radiant energy responsive electric signalling
Semiconductor system
C438S080000, C438S107000
Reexamination Certificate
active
06180944
ABSTRACT:
TECHNICAL FIELD
This invention relates to a method for tiling together adjacent discrete array submodules such as thin film transistor panels, and the resulting large panel, and more particularly to a method for tiling together a plurality of TFT submodules on which there is subsequently deposited an imaging layer.
BACKGROUND OF THE INVENTION
The development of large scale image capture and image display devices such as radiographic imaging panels and liquid crystal display devices requires large scale arrays of radiation detection sensors in the first instance and similarly large scale arrays of imaging pixels in the second.
Both the radiation detection sensors and the imaging pixels comprise complex electronic structures which include electronic switching devices in addition to means to either capture an electronic charge representing incident radiation, or means to alter the state of a liquid crystal material to display a visible image.
Radiation detection panels, particularly panels intended for medical radiography applications must be at least 14″×17″ to be commercially useful. Similarly, liquid crystal displays must be of the order of at least 8″×10″ for a laptop personal computer application, and substantially larger for television displays.
Each of those panels comprises a number of individual detectors or display pixels which is in the millions. For instance a 14″×17″ diagnostic quality radiation detection panel will have approximately eight million detectors arrayed in regularly spaced lines and columns, with multiple conductors running in the interstitial spaces between detectors for accessing the detectors and retrieving the signals representing the radiogram. Each detector comprises at least one switching element, usually a Thin Film Transistor, coupled with the actual radiation detector. Even with the currently high quality manufacturing abilities available, yields of commercially useful panels with so many elements are relatively low, and as a result, the cost of such large size panels is high.
The yield rate is related to the overall number of elements in a panel, and rises with the square of the panel size. It is therefore often advantageous to assemble into larger panels of the desired size a plurality of smaller panels which may be produced at higher yields at substantially lower cost. This process of making larger panels from a plurality of smaller panels is typically referred to in the art as “tiling”. U.S. Pat. No. 5,381,014 issued to Jeromin et al., whose contents are incorporated herein by reference, as well as U.S. Pat. No. 5,254,480 issued to Tran, and U.S. Pat. No. 5,315,101 issued to Hughes et al., describe such tiling process.
The process for assembling the smaller panels or submodules, into a larger panel, typically involves adjoining two or four submodules by placing an adhesive along the adjoining edges and adhering the submodules to each other. The aforementioned Jeromin et al patent teaches placing the submodules to be joined on a supporting dielectric base and adhering the submodules both to each other and to the supporting base. Still according to the teachings of Jeromin et al., the abutting submodule edges are ground to a high degree of precision and contain a beveled portion in the vicinity of the supporting base.
Typically, after joining the submodules, completion of an imaging panel entails depositing a continuous radiation detecting material layer such as selenium, or a continuous image display layer, over the assembled submodules to provide a means to detect incident radiation or to display an image.
While this technique has provided generally good results, it has been observed that the larger panel response to in the vicinity of the submodule juncture is deficient. The deficiency has been tracked, among other reasons, to the formation of bubbles in the imaging layer above the junction between the panels. We will refer to this junction hereinafter as the “seam”. These bubbles were attributed to gas being released from the adhesive in the seam, typically an epoxy, during deposition of the imaging layer.
There is need therefore, to provide a method of alleviating this gassing problem in the seams between adjacent submodules.
SUMMARY OF THE INVENTION
In accordance with this invention, there is provided a method for forming a large imaging panel by assembling a plurality of smaller submodules, the method comprising providing an adhesive filler between two abutting edges of a first and a second submodule, and forming a degassing channel in the adhesive filler extending along the length of the abutting edges.
The method may further comprise forming the large detection panel by adhering the smaller radiation detection submodules onto a top surface of a base plate, beveling at least a portion of the abutting edges of the submodules, and forming the degassing channel in the space between the beveled edges of the abutting panels and the top surface of the supporting plate.
Still according to the present invention there is provided an X-ray image capture panel comprising:
a base plate having a top surface;
a plurality of discrete array submodules juxtaposed over the top surface of the base plate such that each submodule is disposed adjacent to at least one other submodule to form a two-dimensional mosaic of submodules having seams therebetween, each of said submodules including a dielectric substrate having a top surface and a bottom surface disposed adjacent the top surface of said base plate, and a plurality of transistors arrayed adjacent the top surface of said dielectric substrate, and each of said seams being filled with filler material and a vented channel in the seam adjacent to the top surface of said base plate; and
a continuous radiation detecting layer disposed over the plurality of array submodules, said radiation detecting layer for producing electrical charges representative of a pattern of incident x-ray radiation.
REFERENCES:
patent: 4843035 (1989-06-01), Takashima
patent: 5105087 (1992-04-01), Jagielinski
patent: 5254480 (1993-10-01), Tran
patent: 5315101 (1994-05-01), Hughes et al.
patent: 5319206 (1994-06-01), Lee et al.
patent: 5369281 (1994-11-01), Spinnler et al.
patent: 5381014 (1995-01-01), Jeromin et al.
patent: 5391236 (1995-02-01), Krut et al.
Jeromin Lothar S.
Robinson George D.
Direct Radiography Corp.
Hannaher Constantine
Ratner & Prestia
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