Large area multiple-chip probe assembly and method of making the

Details Large area multiple-chip probe assembly and method of making the Large area multiple-chip probe assembly and method of making the

1997-06-16

1999-11-02

Brown, Glenn W.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324758, 324760, G01R 1073

Patent

active

059777877

ABSTRACT:
A multiple-chip probe assembly suitable for wafer testing over a wide temperature range includes a plurality of individual buckling beam probe elements. A support structure supports the plurality of buckling beam probe elements in an arrangement in accordance with an electrical contact footprint for use in electrically contacting multiple chips of a wafer under test and enables buckling movement in a contacting direction of the plurality of buckling beams. The support structure includes a principal support material having a thermal coefficient of expansion (TCE) matched with the wafer under test and a second material other than the principal support material, wherein a contact positioning of the plurality of buckling beam probe elements upon the wafer under test during a testing operation is maintained. The second material prevents an individual probe element from electrically contacting the principal support material.

REFERENCES:
patent: 3806801 (1974-04-01), Bove
patent: 4063172 (1977-12-01), Faure
patent: 4506215 (1985-03-01), Coughlin
patent: 4686464 (1987-08-01), Elsasser et al.
patent: 4783624 (1988-11-01), Sabin
patent: 4901013 (1990-02-01), Benedetto et al.
patent: 4963822 (1990-10-01), Prokopp
patent: 5210485 (1993-05-01), Kreiger et al.
patent: 5367254 (1994-11-01), Faure
patent: 5385477 (1995-01-01), Vaynkof et al.
patent: 5488314 (1996-01-01), Brandt et al.
patent: 5517126 (1996-05-01), Yamaguchi
patent: 5521522 (1996-05-01), Abe et al.
patent: 5600257 (1997-02-01), Leas et al.
Lorber et al., "Non-Adhering Probe for Contacting Solder Pads," IBM Technical Disclosure Bulletin, vol. 26, NO. 1, Jun. 1983, p. 251.
"Method of Chip Burn-In," IBM Technical Disclosure Bulletin, vol. 38, No. 11, Nov. 1995, pp. 191-192.

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