Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-11-17
2011-11-08
Parker, Kenneth (Department: 2815)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S029000, C438S034000
Reexamination Certificate
active
08053260
ABSTRACT:
Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic light emitting module is electrically coupled to the anode of an adjacent light emitting module in an interconnect region. A portion of the cathode of each module extends adjacent to an active area of an adjacent module at an interconnect region. Methods of fabricating series groups of organic light emitting modules employing continuous material layers is also provided.
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State Intellectual Property Office, P.R. China, Unofficial English Translation of First Office Action issued on Mar. 10, 2011, 7 pages.
Balch Ernest Wayne
Faircloth Tami Janene
Foust Donald Franklin
Liu Jie
Nealon William Francis
General Electric Company
Ho Anthony
Parker Kenneth
Yoder Fletcher
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