Electrical resistors – With base extending along resistance element – Resistance element and/or terminals printed or marked on base
Patent
1982-06-17
1983-10-18
Mayewsky, Volodymyr Y.
Electrical resistors
With base extending along resistance element
Resistance element and/or terminals printed or marked on base
29613, 174 52FP, 219209, 219543, 338309, H01C 1012
Patent
active
044108745
ABSTRACT:
A ceramic substrate includes a multiplicity of alternately screened and fired conductor and dielectric levels, with interconnections between levels through small via holes in the dielectric layers or alternately by means of crossovers. Thick film resistors are incorporated throughout the ceramic substrate, wherever needed, and the thick film resistors are printed and trimmed through windows which extend through any upper layers. In addition, resistors may be printed directly on top of the dielectric layers where necessary. Selective area hermetic sealing is utilized only for those chips and wire bonds which require environmental protection by placement of a ring frame seal encircling the selected area and over insulation on substrate conductors which are routed directly beneath the sealing area. A lid is directly soldered to the frame and, before final sealing, a proper environment is created within a sealed area. Where equivalent chip versions of electronic components are not available, discrete components are soldered directly to the ceramic substrate outside of the sealed area. Necessary thermal dissipation can be afforded by direct mounting of the multilevel substrate on a heat sink.
REFERENCES:
patent: 3395265 (1968-07-01), Weir
patent: 3887785 (1975-06-01), Ahlport
patent: 4372037 (1983-02-01), Scapple et al.
Gioia, "Multilayering for a Low Cost Hermetic Thick-Film Substrate Package", Solid State Technology, Jul. 28, 1972.
Grieger Robert G.
Himmel Richard P.
Keister Frank S.
Scapple Robert Y.
Bethurum W. J.
Hughes Aircraft Company
Karambelas A. W.
Mayewsky Volodymyr Y.
Sternfels Lewis B.
LandOfFree
Large area hybrid microcircuit assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Large area hybrid microcircuit assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Large area hybrid microcircuit assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1292246