Large area flat image sensor assembly

Details Large area flat image sensor assembly Large area flat image sensor assembly

2007-10-02

2007-10-02

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S118000, C438S123000

Reexamination Certificate

active

10922529

ABSTRACT:
A low temperature method for producing a substantially flat large area image sensor assembly, the method includes the steps of providing a die attach substrate having a substantially planar surface; providing a lead frame having a bonding surface and a plurality of leads extending there from; adhering an imager die to the substantially planar surface of the die attach substrate with a low curing temperature first adhesive; and adhering the die attach substrate with adhered imager die to a bonding surface of the lead frame with a low curing temperature second adhesive for producing an image sensor assembly.

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